Winbond Electronics Corporation is a total memory solution provider. The company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.
FLASH Memory IC 4Mbit SPI 104 MHz 8-SOIC
FLASH Memory IC 2Mbit SPI 104 MHz 8-USON (2×3)
FLASH – NOR Memory IC 16Mbit SPI – Quad I/O 133 MHz 8-SOIC
FLASH – NOR Memory IC 32Mbit SPI – Quad I/O 133 MHz 8-WSON (6×5)
SDRAM – DDR2 Memory IC 512Mbit Parallel 400 MHz 57.5 ns 84-VFBGA (8×12.5)
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